TRF-45 PCB: 2-Layer 32mil Thick ENIG Finished High-Frequency Circuit Board
1.Introduction
The TRF-45 laminated materials represent a new generation of low-loss, thermally-stable laminated material from Taconic Advanced Dielectric Division. TRF-45 is woven-glass reinforced for enhanced dimensional stability and coupled with Taconic's expertise in ceramic technology. It exhibits low and consistent Z-axis expansion across a wide range of temperatures, including soldering conditions.
TRF-45 can be sheared, drilled, and plated using standard methods for PTFE woven fiber-glass materials, making it ideal for high-frequency applications.
2.Features
Low-loss ceramic-filled PTFE for superior RF performance
Stable Dielectric constant (Dk) of 4.5±0.15 at 10GHz over temperature and frequency
Dissipation factor of 0.0035 at 10GHz
Moisture absorption of only 0.06%
Excellent CTE stability: X/Y-axis CTE of 9 ppm/°C, Z-axis CTE of 40 ppm/°C (50°C to 150°C)
Thermal conductivity of 0.43 W/mK
UL 94-V0 flammability rating for safety compliance
3.PCB Specifications at a Glance
| Parameter | Specification |
|---|---|
| Base Material | TRF-45 |
| Layer Count | Double-sided |
| Board Dimensions | 50mm x 50mm (±0.15mm) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Finished Board Thickness | 0.9mm (32mil core) |
| Copper Weight (Outer Layers) | 1oz (35µm) |
| Via Plating Thickness | 20µm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Solder Mask & Silkscreen | None |
| Electrical Test | 100% tested prior to shipment |
4.PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
TRF-45 Core - 0.813 mm (32mil)
Copper_layer_2 - 35 μm
5.PCB Statistics:
Components: 12
Total Pads: 27
Thru Hole Pads: 19
Top SMT Pads: 8
Bottom SMT Pads: 0
Vias: 11
Nets: 2
6.Typical Applications
Satellite radio antennas
RFID antennas
GPS antennas
7.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support